Open · 29 days left
Germany – Microelectronic machinery and apparatus and microsystems – Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Fraunhofer-Gesellschaft, Einkauf B12
neg-w-call by Fraunhofer-Gesellschaft, Einkauf B12, bids due 2 Dec 2026. In similar contracts this buyer gets a median of 1 bids per lot.
- Estimated value
- —
- Submission deadline
- 2 Dec 202611:00, Brussels time
- Procedure
- neg-w-call
- CPV
- 31712000Microelectronic machinery and apparatus and microsystems
- Published
- 2 Nov 2026TED
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How contested it usually is
Based on 3 contracts in the same sector awarded by this buyer in the last 3 years. Small sample: indicative only.
1bidders per lot, median
56%of lots had a single bid
—below the estimate, median discount
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